Application and development trend of TGV technology in advanced packaging

TGV (Through-Glass Via) technology is increasingly used in advanced packaging and has become a key technology for achieving high-speed and high-frequency signal transmission between chips. TGV technology forms vertically penetrating microholes on the glass substrate to achieve short-distance and small-pitch interconnection between chips, and has excellent electrical, thermal and mechanical properties. With the continuous development and improvement of technology, TGV technology has broad application prospects in the fields of RF chips, high-end MEMS sensors, high-density system integration, etc. It is expected that in the next few years, TGV technology will play a greater role in the field of advanced packaging and promote the sustainable development of related industries.