The main building of Zhongjiang Semiconductor IGBT project was capped

The main building of Zhongjiang Semiconductor's IGBT copper-clad ceramic substrate industrialization project has been capped and is entering the secondary structure construction stage. This project is one of the major municipal projects in Jiangsu Province in 2024. It is constructed by Nanjing Zhongjiang New Materials Technology Co., Ltd. with a total investment of 1 billion yuan. It is expected to start equipment installation at the end of April this year and be completed and put into production at the end of October.