Huatian Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base Phase II Project Signed

The total investment of the second phase of the Huatian Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base project is about 10 billion yuan, and the project land area is about 188 acres. It is planned to build a new 200,000 square meters of factory buildings and supporting facilities, and introduce new high-end production equipment. The project products are positioned in the high-end packaging of resin substrates, and the packaging form is mainly Chiplet/FCBGA/SiP, which is mainly used in storage, radio frequency, computing power (AI), autonomous driving and other fields. The project was officially signed on March 28, 2024.