Your company's 2.5D and 3D advanced packaging are currently in the mass production stage. How are these two compared to the previous two years? Have they increased in volume? Can you give us a rough idea of ​​how much higher the profit margin of 2.5D and 3D packaging is than that of traditional packaging?

Changdian Technology: Dear investors, hello. In 2021, Changdian Technology launched the XDFOI technology platform for multi-dimensional fan-out packaging integration for 2.5D and 3D packaging requirements. It has currently cooperated with major domestic and foreign customers in the product development and launch of Chiplet. And in the past few years, it has continued to promote the research and development, mass production and global layout of diversified solutions. The company's XDFOI technology platform covers the mainstream 2.5DChiplet solutions on the current market, which are three technical paths with redistribution layer (RDL) adapter board, silicon adapter board and silicon bridge as intermediary layers, and all have production capacity. Based on the technical difficulty and process complexity, the value of Chiplet advanced packaging has been greatly improved compared to traditional packaging. Thank you for your attention and support.