What is the current mass production status of XDFOI? Can you tell us about your expectations? Your company's stock price has plummeted by more than 10% in the past three days. Have the fundamentals changed?

Changdian Technology: Dear investors, hello. Changdian is currently cooperating with major domestic and foreign customers in the development and launch of chiplet products. Changdian Technology has launched the XDFOI technology platform for multi-dimensional fan-out packaging integration for 2.5D and 3D packaging requirements, and continues to promote the development, mass production and global layout of diversified solutions. The company's XDFOI technology platform covers the mainstream 2.5D Chiplet solutions on the current market, which are three technical paths with redistribution layer (RDL) adapter, silicon adapter and silicon bridge as the intermediate layer, and all have production capacity. At present, the company's production and operations remain stable and normal. Since the second quarter of last year, the company has quickly passed the adjustment low point. The second and third quarters of the operation continued to recover, achieving a month-on-month increase in revenue and a continuous recovery in profitability, and strive to promote the fourth quarter performance to continue to maintain a steady recovery trend. Thank you for your attention and support.