Intel launched the Core Ultra "MeteorLake" CPU based on the storage and computing separation architecture, which uniformly encapsulates various IPs in the form of chiplets. I understand that your company cannot comment on a single product or customer. Regarding the advanced chiplet packaging, does Changdian currently have any cooperation with major domestic and foreign customers in terms of advanced product development and launch? In addition, foreign chip manufacturers are actively using chiplets to develop new products, and the performance is very good. From your perspective, how is the over

Changdian Technology: Dear investors, hello. Changdian is currently cooperating with major domestic and foreign customers in the development and launch of chiplet products. Changdian Technology has launched the XDFOI technology platform for multi-dimensional fan-out packaging integration for 2.5D and 3D packaging requirements, and continues to promote the development, mass production and global layout of diversified solutions. The company's XDFOI technology platform covers the mainstream 2.5D Chiplet solutions on the current market, which are three technical paths with redistribution layer (RDL) adapter board, silicon adapter board and silicon bridge as the intermediate layer, and all have production capacity. Thank you for your attention and support.