Dear Secretary, Hello, HBM (high-performance bandwidth) and advanced packaging technology have been widely used in artificial intelligence recently, which has greatly improved the performance of AI acceleration chips. 1. As a leading packaging and testing company in China, what is the current level of stacking technology that the company can achieve? 2. Does the company have any cooperation with leading domestic companies such as Huawei HiSilicon and Yangtze Memory in the field of advanced packaging?

Changdian Technology: Dear investors, hello. The XDFOI high-performance packaging technology developed by the company is also suitable for ChiptoWafer and ChiptoChipTSV stacking applications for high-bandwidth storage. As a domestic packaging and testing company with the most diversified global high-quality and stable customer base, the company has maintained stable and long-term customer relationships with most domestic and international leading integrated circuit companies. Thank you for your attention and support to the company.