快报列表

GlobalWafers seeks to replace Wolfspeed customer orders 2025-05-27 20:10
Nvidia cuts CoWoS advanced packaging orders, TSMC responds vaguely 2025-03-04 14:31
TSMC outsources WoS capacity in CoWoS advanced packaging 2025-02-24 15:30
GlobalWafers Chairman Xu Xiulan talks about SiC market outlook 2025-02-18 14:00
Introduction to Guangzhou Nansha Semiconductor Technology Co., Ltd. 2025-01-16 11:30
GlobalWafers plans to build new factories in Europe and the United States 2025-01-09 06:40
Dear Secretary, Hello, HBM (high-performance bandwidth) and advanced packaging technology have been widely used in artificial intelligence recently, which has greatly improved the performance of AI acceleration chips. 1. As a leading packaging and testing company in China, what is the current level of stacking technology that the company can achieve? 2. Does the company have any cooperation with leading domestic companies such as Huawei HiSilicon and Yangtze Memory in the field of advanced packaging? 2024-12-31 11:38
Wolfspeed leads the transformation of 8-inch silicon carbide wafers 2024-12-31 07:59
Chinese 8-inch SiC manufacturers actively deploy 2024-12-31 04:07
TSMC advances high-end packaging technology through 3D Fabric Alliance 2024-12-30 14:55
GlobalWafers' third-quarter performance declined, but the outlook for the semiconductor industry is optimistic by 2025 2024-12-28 05:20
Nanjing Weice Integrated Circuit Chip Wafer-Level and Finished Product Testing Base Project Starts Completion Acceptance 2024-12-27 18:48
ZMC acquires Pure Wafer to boost U.S. wafer fab capacity expansion 2024-12-27 14:28
TSMC begins using InFO_SoW technology to produce Tesla Dojo AI training modules 2024-12-27 08:23
Zhongxin Wafer's 12-inch BCD silicon wafer product achieved a technological breakthrough 2024-12-27 04:54