1) I see that companies are planning to package and test memory chips such as DRAM and NAND. What are the differences in the packaging and testing processes and equipment required for these two products? Are the barriers to entry high for other packaging and testing companies that focus on a certain product, or even IC design companies? 2) Are there any differences in the processes and equipment required for memory packaging and testing and logic chip packaging and testing?

Changdian Technology: Dear investors, hello. There is no obvious difference between the two in the low-end market, and both can use traditional wire bonding equipment to achieve stacking and wire bonding interconnection. In the mid-to-high-end field, there are differences in the equipment processes of the two, and special equipment such as thermal compression bonding is required. At the same time, the equipment required for memory and logic chip packaging and testing is different due to the different stacking layers and testing requirements. For new entrants, there are obvious barriers in the mid-to-high-end storage packaging and testing market. Thank you for your attention and support.