Does your company have plans for CoWoS advanced packaging technology?

Changdian Technology: Dear investors, hello. The company has made corresponding deployments in related high-performance packaging fields. Changdian Technology has launched a technology platform for multi-dimensional fan-out packaging integration (XDFOI) for 2.5D and 3D packaging requirements, covering multiple packaging integration solutions such as 2D, 2.5D and 3D, and has achieved mass production. This technology is an extremely high-density, multi-fan-out packaging high-density heterogeneous integration solution for chiplets. It now has the mass production capacity of 4nm and chiplet advanced packaging technology, and has begun to provide high-performance advanced packaging solutions for chiplet architectures to domestic and foreign customers and deploy corresponding capacity allocations in a timely manner. Thank you for your attention to the company.