快报列表
Ideal Auto believes that VLA can achieve the goal of combining 3D and 2D vision.
2025-05-21 21:00
TAGE Intelligent Driving launches MineSim, a closed-loop simulation test system for unmanned driving scenarios in open-pit mines
2025-03-05 09:10
The world's first full-size open source humanoid robot "Qinglong" is equipped with RoboSense E1R LiDAR
2025-02-27 09:20
MetaVision is the only image sensor supplier in the world that has successfully applied 2D LOFIC technology to automotive-grade CIS
2025-01-22 18:03
Rohde & Schwarz and IHP successfully verify D-band 6G and automotive radar wireless test equipment
2025-01-09 20:40
TI launches next-generation radar sensors and automotive audio processors with edge AI
2025-01-09 13:33
Wanjie Technology and Beijing Academy of A-Systems jointly released the world's first roadside dataset for vehicle-road cooperative autonomous driving
2025-01-09 06:20
LG Automotive's xDC platform improves driving experience
2025-01-07 14:49
RoboSense releases multiple digital lidars
2025-01-04 23:23
Qiangyi Semiconductor IPO raised 1.5 billion yuan for R&D and production projects
2025-01-03 20:23
Analysis of the core technologies of Tesla's FSD system
2025-01-01 01:03
Hello, Secretary Dong, ① Are your high-density packaging technologies such as 3D stacking and TSV ready for mass production? If not, what stage is the development currently in? ② What are the gross profit margins and revenue share of your traditional packaging (through-hole insertion, surface mount) and advanced packaging (area matrix packaging, SiP, high-density packaging)? ③ Your company's revenue in the third quarter increased by 19% year-on-year, but net profit attributable to shareholders increased by 99% year-on-year. What is the main reason for the increase in net profit in the third qu
2024-12-31 19:20
Hello, Secretary Dong, Huawei recently launched the "stacked packaging" patent. I would like to ask if your company has any similar technical accumulation.
2024-12-31 18:25
Your company has recently achieved the simultaneous shipment of 4-nanometer node multi-chip system-integrated packaging products, with the largest package area being about 1,500 square millimeters. Regarding this 4-nanometer multi-chip system-integrated packaging product and the packaging area of up to 1,500 square millimeters, can your company introduce more technical details of the packaging method used this time, how many chips are integrated in this area, and whether it is a two-dimensional method or a stacked method? Thank you for your answer.
2024-12-31 15:43
Does your company have plans for CoWoS advanced packaging technology?
2024-12-31 12:39