Will the explosive market for semiconductor chips driven by AI bring unprecedented business opportunities to the company's packaging and testing business?

Changdian Technology: Dear investors, hello. The application of ChatGPT and AI has promoted the rapid development of high-performance computing (HPC) systems. The system-level, one-stop packaging and testing solution created by Changdian Technology for it fully covers the infrastructure of the HPC system, namely computing modules, storage modules, power modules, and network modules. It can provide customers with solutions for the diversified application needs of each module and HPC system, creating greater added value for customers. In the field of computing modules, Changdian Technology's XDFOI? series of processes can provide multi-layer ultra-high-density routing and ultra-narrow pitch bump interconnections, integrating multiple bare chips, high-bandwidth memory (HBM) and passive devices, while optimizing costs to achieve better performance and reliability. The solution has entered stable mass production and has realized ultra-large-size high-density fan-out flip-chip technology; for storage modules, Changdian Technology has ultra-thin chip packaging to help the system's miniaturization solution. At the same time, Changdian Technology makes full use of 2.5D/3D high-performance heterogeneous heterogeneous integrated packaging technology to achieve "storage and computing integration"; for power modules, Changdian Technology has complete power device packaging technology and mass production experience, covering new material power devices such as silicon carbide (SiC) and gallium nitride (GaN) and a variety of discrete and chip-level packaging, especially in heat dissipation and reliability, with a number of patented technologies, and mastering mature IGBT and inverter packaging technology; for network modules, Changdian Technology has carried out technical cooperation with domestic and foreign customers on CPO optoelectronic package products for many years, and the solution has expanded from mobile phone products to high-speed data transmission applications in data centers. Thank you for your attention to the company.