It is rumored that your company is cooperating with several leading chip manufacturers in China to produce chips containing chiplet technology. Is this true?

JCET: Dear investors, thanks to the long-term experience and patents accumulated by STATS ChipPAC, a wholly-owned subsidiary of the Group, in chiplet-related technical fields, JCET has accumulated rich experience in large-scale mass production in recent years through domestic production subsidiaries for high-density integration of multiple small chips under the chiplet architecture; at the same time, the production introduction of ultra-high-density packaging integration based on small chips below 5 nanometers for international customers is also progressing smoothly. JCET also has the large-scale mass production and testing experience of the back-end ultra-large-size FCBGA packaging that is essential for supporting chiplets, as well as the 16-layer chip ultra-thin stacking and interconnection technology capabilities for high-speed memory chips, making full process technology preparations for the future fast-growing computing and storage chip heterogeneous integration market, ensuring that the relevant technology and production and manufacturing experience are in a leading position among domestic and foreign peers. The company has jointly developed a 2.5DfcBGA product based on high-density Fan-out packaging technology with its customers, and has also certified the fcBGA of TSV heterogeneous bonding 3DSoC, which has increased the number and performance of integrated chips and laid a solid foundation for further comprehensive development of high-density and high-performance packaging technology required for chiplets. Thank you for your attention to our company.