Dear Secretary, hello. The company has the largest patent reserve in the domestic packaging and testing industry, but its gross profit is slightly lower than other companies in the same industry. What kind of advantages does the company's numerous patent technologies reflect? Are there any technologies that other domestic companies cannot do?

Changdian Technology: Hello, if the same business or product is compared, the company's gross profit margin is not lower than that of domestic peers. The gross profit margins of individual factories vary, mainly because of the different product and business combinations of the factories, or different business models. As the world's third and the first packaging and testing company in mainland China, the company's technical research and development capabilities have ranked among the first-class level of the global packaging and testing industry, and it is in a leading position in China in terms of both comprehensiveness and advancement of technology. The core technologies that Changdian Technology focuses on cultivating, including high-density SIP technology for RF applications, high-density fan-out wafer-level technology, flip-chip technology, high-reliability power device packaging technology and product research and development, are in a leading position in the industry. For example, last year the company announced the official launch of XDFOI? A full range of ultra-high-density fan-out packaging solutions that can effectively improve the heterogeneous integration of IO density and computing power density within the chip is seen as a new opportunity for the development of advanced packaging and testing technology. This packaging solution is a new type of silicon-free wafer-level ultra-high-density packaging technology, which has higher performance, higher reliability and lower cost compared to 2.5D silicon-through-via (TSV) packaging technology. This solution can achieve multiple wiring layers while the line width or line spacing can reach 2um. In addition, it adopts ultra-narrow pitch bump interconnection technology, with a large package size, and can integrate multiple chips, high-bandwidth memory and passive devices. Changdian Technology XDFOI? The full range of solutions will expand more possibilities for heterogeneous integration with unique technical advantages. This solution will enter production in the second half of the year. Thank you!