Hello, Secretary Dong. May I ask what new layout has Changdian Technology made in terms of innovative technology research and development and new energy in the recent national 14th Five-Year Plan for scientific and technological development? Increasing investment in innovation is crucial to the company's development. We need to gradually move away from the single main business of assembly and packaging and testing. It is recommended that the company increase investment in technology research and development of new energy vehicle chips to make them bigger and stronger. In addition, it is recomm

Changdian Technology: Hello, the company continues to focus on the development of innovative technologies and the expansion of advanced applications. In the field of 5G, it actively invests in the research and development of Sub-6GHz, millimeter wave antenna packaging, RF front-end (RFFE) modules and system-level packaging (SiP), and has been cooperating with high-end customers. In terms of high-performance computing applications, we cooperate with different wafer manufacturers on the most advanced 5/7nm to 14/16nm silicon node technologies. In the automotive market, we have been working closely with major customers to develop packaging technologies related to electric vehicles and autonomous driving with higher reliability standards. In the first half of 2021, Changdian Technology established the "Automotive Electronics Business Center". With the help of talents and expertise from the automotive electronics manufacturing field in Japan and South Korea, it will go deep into the rapidly growing automotive electronics market, develop product platforms and service platforms dedicated to automotive electronics, and continuously expand and deepen strategic cooperation with key automotive electronics customers, and strive to create new momentum for corporate development. At the same time, the company has expanded beyond the field of packaging manufacturing and established a "Design Service Business Center" to provide customers with packaging design services with advanced design concepts and years of accumulated advanced packaging mass production experience, further enhancing Changdian Technology's support for the entire life cycle of customer products. This year, the company announced the official launch of XDFOI? A full range of ultra-high density fan-out packaging solutions that can effectively improve the heterogeneous integration of IO density and computing power density within the chip is seen as a new opportunity for the development of advanced packaging and testing technology. This packaging solution is a new type of wafer-level ultra-high density packaging technology without silicon vias. Compared with 2.5D silicon via (TSV) packaging technology, it has higher performance, higher reliability and lower cost. This solution can achieve multi-layer wiring layers while the line width or line spacing can reach 2um. In addition, it adopts ultra-narrow pitch bump interconnection technology, with a large package size, which can integrate multiple chips, high-bandwidth memory and passive devices. At present, ultra-high density wiring has been completed, and the customer sample process is about to start, and mass production is expected in the second half of next year. The key application areas are:...