The secondary market has always believed that the company has no technical barriers, so institutions look down on it. Is this true? Is the company's technical content very low? What are the advantages and barriers?

Changdian Technology: Hello, as the third largest packaging and testing company in the world and the first in mainland China, the company's technical research and development strength has ranked among the first-class level in the global packaging and testing industry. It is in a leading position in China in terms of comprehensiveness and advancement of technology. The core technologies that Changdian Technology focuses on cultivating, including high-density SIP technology for RF applications, high-density fan-out wafer-level technology, flip-chip technology, high-reliability power device packaging technology and product research and development, are in a leading position in the industry. For example, the company recently announced the official launch of XDFOI? A full range of ultra-high-density fan-out packaging solutions that can effectively improve the heterogeneous integration of IO density and computing power density within the chip is regarded as a new opportunity for the development of advanced packaging and testing technology. This packaging solution is a new type of silicon-free wafer-level ultra-high-density packaging technology. Compared with 2.5D silicon-through-via (TSV) packaging technology, it has higher performance, higher reliability and lower cost. This solution can achieve multi-layer wiring layers while the line width or line spacing can reach 2um. In addition, it adopts ultra-narrow pitch bump interconnection technology, with a large package size, and can integrate multiple chips, high-bandwidth memory and passive devices. Changdian Technology XDFOI? Full range of solutions will expand more possibilities for heterogeneous integration with unique technical advantages. Changdian Technology XDFOI? Full range of solutions has completed ultra-high density wiring and is about to start customer sample process. "Two-thirds of the company's fixed asset investment this year is used for capacity expansion related to advanced packaging technology, which has its own unique technical advantages and barriers. The company will continue to rely on its global diversified customer resources, global strategic layout and the most international management capabilities in the domestic packaging and testing industry, and continue to lead the development direction of packaging and testing technology in mainland China, and seize opportunities to achieve leapfrog development. Thank you!