Hello, Secretary Dong! Is your company's silicon-free through-silicon via wafer-level ultra-high density packaging technology ready for mass production?

Changdian Technology: Hello, Changdian Technology's silicon-free through-hole wafer-level ultra-high density packaging technology (such as 2.5DXDFOI, etc.) is currently in the verification stage and is expected to be mass-produced before the end of next year. The key application areas are: high-performance computing applications such as FPGA, CPU/GPU, AI, 5G, autonomous driving, smart medical care, etc. Thank you!