Micron Technology invests $7 billion in Singapore to build HBM advanced packaging plant

Micron Technology launched a major investment in Singapore on January 8, 2025, with the official groundbreaking of its high-bandwidth memory (HBM) advanced packaging plant. The project is expected to start operations in 2026 and expand Micron's total advanced packaging capacity in 2027 to meet the continued growth in the field of artificial intelligence. The total investment is approximately US$7 billion, demonstrating Micron Technology's confidence in advanced packaging technology and its active response to market demand.