Nvidia plans to introduce fan-out panel-level packaging technology to ease production capacity pressure

AI chip giant Nvidia plans to introduce fan-out panel-level packaging (FOPLP) technology in 2026 to alleviate the problem of tight production capacity of CoWoS advanced packaging, thereby solving the problem of insufficient supply of AI chips. In addition, semiconductor giants such as Intel and AMD are also expected to join the ranks of FOPLP technology.