Innolux actively transforms and develops FOPLP technology

Innolux is currently actively transforming and developing panel-level fan-out packaging (FOPLP) technology using its own panel production line. Innolux has announced that 2024 will be the "first year of mass production of advanced packaging" in the semiconductor field. The first phase of production capacity of its related product lines has been fully booked, and it plans to start shipping in the third quarter of this year.