Nvidia cuts CoWoS advanced packaging orders, TSMC responds vaguely

According to supply chain news, Nvidia has decided to cut its CoWoS advanced packaging orders, and has not reached an agreement with TSMC on the commissioned orders for the CoW (Chip on Wafer) front-end packaging process. Although TSMC's advanced process capacity utilization is still close to full load, even exceeding the output at the beginning of the year, as Nvidia's previous generation Hooper GPU's life cycle is approaching the end, the total order volume may gradually decrease, waiting for the launch of the next-generation product GB300 to boost demand.