Xcell Semiconductor Launches 3DIC Chiplet Multi-Physical Field Simulation Platform

Xinhe Semiconductor, known as the "Chinese ANSYS", recently launched its self-developed 3DIC Chiplet multi-physics simulation platform. The platform is designed to solve problems in signal integrity, power integrity, electromagnetics, heat and stress, and help the chip design field move from single-chip (SoC) to multi-chip system development.