SpaceX and Innolux collaborate to promote panel-level packaging technology

SpaceX is increasing its investment in panel-level packaging (FOPLP) technology and requires partners to expand production lines to meet the mass production needs of highly integrated chips for its low-orbit satellites. It is reported that SpaceX has signed a contract with Innolux, which is expected to receive a large order for power management chips and strive to achieve FOPLP mass production this year.