Huawei applies for a patent for a "four-chip" packaging design, which may be used for the next-generation AI chip Ascend 910D

Huawei has recently applied for a patent for a "four-chip" packaging design, which may be used for the next-generation AI chip Ascend 910D. This design is similar to the architecture of NVIDIA Rubin Ultra, but Huawei seems to be developing its own advanced packaging technology. If the technology is successful, Huawei will not only be able to compete with TSMC, but may also catch up with NVIDIA's AI GPU.