Lingming Photonics Completes C+ Round of Financing

Lingming Photonics recently completed a new round of financing and introduced SAIC Venture Capital as a new shareholder. The financing will be used for the research and development and mass production of 3D sensing chips. Lingming Photonics focuses on SPAD technology and has successfully developed a series of SPAD products, which have been applied in smart cars, high-end mobile phones and other fields. In addition, the company has also released automotive-grade certified SiPM products and pure solid-state laser radar SPAD chips, which have been recognized by international leading laser radar manufacturers.