SemiDrive Technology completes nearly RMB 1 billion in Series B+ financing to promote mass production of automotive chips

Recently, domestic chip company CoreDrive Technology successfully completed a B+ round of financing of nearly 1 billion yuan. This round of financing was led by SAIC Jinshi Innovation Industry Fund, and other investors included CITIC Securities Investment, Jiangsu Jinshi Transportation Technology Industry Fund, etc. CoreDrive Technology plans to use this money to enhance its core technology and strengthen the mass production and service capabilities of automotive chip products. The company has launched four major series of products: smart cockpit, smart driving, central gateway and high-performance MCU, all of which have been mass-produced and put into use. At present, CoreDrive Technology has covered 90% of car companies, has more than 100 mass production projects, and has more than 260 customers.