ICP Semiconductor Chiplet Packaging Technology Platform COORS

ICP Semiconductor has successfully launched the original COORS (Chip On Organic Redistribution Substrate) chiplet packaging technology platform, including two solutions, COORS-R and COORS-V. COORS-R integrates multiple chips heterogeneously, uses high-precision thermal compression bonding to connect to the organic redistribution layer, and realizes high-density interconnection of multiple chips.