Raytheon and AMD to develop new packaging technology to be manufactured in Lompoc, California

The new packaging technology developed by Raytheon in collaboration with AMD will be manufactured at the company's facility in Lompoc, California, USA. This packaging technology will use an interposer designed by Raytheon and will leverage AMD's expertise in 2.5D and 3D direct integration technologies. Raytheon has a decades-long partnership with AMD's Xilinx to develop FPGA solutions, so this new packaging technology may be processed on Xilinx's FPGAs.