Does the company currently have any applications or reserves of CoWos packaging technology?

Changdian Technology: Dear investors, hello. In 2021, Changdian Technology launched the XDFOI technology platform for multi-dimensional fan-out packaging integration for 2.5D and 3D packaging requirements. It has currently cooperated with major domestic and foreign customers in the product development and launch of chiplets. And in the past few years, it has continued to promote the research and development, mass production and global layout of diversified solutions. The company's XDFOI technology platform covers the mainstream 2.5DChiplet solutions on the current market, which are three technical paths with redistribution layer (RDL) adapter board, silicon adapter board and silicon bridge as the intermediate layer, and all have production capacity. Thank you for your attention and support.