Could you please tell me about Changdian Technology’s R&D and application of chiplet technology?

Changdian Technology: Dear investors, hello. Last year, the company announced the official launch of XDFOI? A full range of ultra-high-density fan-out packaging solutions, which can effectively improve the IO density and computing power density of the chip. As a new type of silicon-free wafer-level ultra-high-density packaging technology, compared with 2.5D silicon-through-via (TSV) packaging technology, it has higher performance, higher reliability and lower cost. This solution can achieve multi-layer wiring layers while the line width or line spacing can reach 2um. In addition, it adopts ultra-narrow pitch bump interconnection technology, with a large package size, and can integrate multiple chips, high-bandwidth memory and passive devices. The key application areas of this technology are high-performance computing applications, 5G, autonomous driving, smart medical care, etc. The company is currently continuing to promote the production application of this technology and the introduction of customer products. At the same time, the company actively supports and participates in the formulation of chiplet interconnection standards worldwide. For example, the company joined the UCIe (Universal Chiplet Interconnect Express) industry alliance in June, and is committed to the breakthrough of chiplet core technology and the innovative development of finished products. Changdian Technology will fully rely on its own advantages in terms of technology accumulation, innovation and industrialization capabilities, and actively work with other member companies of the alliance to promote the standardization of chiplet interface specifications, and achieve technology and application innovation guided by market demand. Thank you for your attention and support to the company.