Hello, Secretary Dong, ① Are your high-density packaging technologies such as 3D stacking and TSV ready for mass production? If not, what stage is the development currently in? ② What are the gross profit margins and revenue share of your traditional packaging (through-hole insertion, surface mount) and advanced packaging (area matrix packaging, SiP, high-density packaging)? ③ Your company's revenue in the third quarter increased by 19% year-on-year, but net profit attributable to shareholders increased by 99% year-on-year. What is the main reason for the increase in net profit in the third qu

Changdian Technology: Hello, the company launched XDFOI for 3D packaging in July this year? A full range of ultra-high density fan-out packaging solutions. This technology is an ultra-high density, multi-fan-out packaging high-density heterogeneous integration solution for chiplets, including 2D/2.5D/3D Chiplet, which can provide customers with one-stop services from conventional density to ultra-high density, from extremely small size to extremely large size. It is expected to complete product verification and achieve mass production in the second half of next year. The company's net profit growth rate in the third quarter was higher than the revenue growth rate mainly because: 1. Strong demand from key domestic and foreign customers, various factories continued to adjust product structure, reduce costs and increase efficiency, and effectively improve profit margins; 2. The company strictly controls various operating expenses, strengthens lean management, continuously optimizes financial structure, and reduces financial expenses. For the company's revenue division and gross profit margin level, please refer to the company's regularly disclosed financial reports. We will seriously consider and adopt investors' reasonable suggestions. Thank you.