CoWoS packaging technology helps improve chip performance

CoWoS is an innovative 2.5D and 3D packaging technology. It first connects the chip (such as computing and storage core particles) to the silicon interposer (silicon wafer) through the Chip on Wafer (CoW) packaging process, and then integrates the CoW chip with the substrate to form a three-layer structure of Chip, Wafer, and Substrate. This packaging technology can significantly reduce chip space and improve yield while reducing power consumption and cost.