TSMC plans to build advanced packaging plant in the United States

TSMC reportedly plans to build two advanced packaging plants in the United States in 2028, using SoIC and CoPoS technologies respectively. The plants are expected to be built next to the third wafer plant in Arizona, which will use N2 and A16 process technologies. The first plant focuses on the SoIC process for 3D vertical integration, while the second plant will apply the CoPoS panel-level large-scale 2.5D integration, which is still in its infancy, to meet demand after 2030.