Alphawave Semi Demonstrates Industry's First 64 Gbit/s Die-to-Die IP Subsystem

Canadian semiconductor IP company Alphawave Semi recently demonstrated the industry's first 64 Gbit/s Die-to-Die (D2D) IP subsystem for Universal Chiplet Interconnect (UCIe) technology. This third-generation chiplet interconnect IP will be built using TSMC's 3nm process technology and based on TSMC's advanced packaging technology and standards, following the latest Gen2 36 Gbit/s and Gen1 24 Gbit/s implementations. The IP is highly configurable and supports multiple protocols, including AXI-4, AXI-S, CXS, CHI, and CHI-C2C, to meet the growing demand for high-performance connectivity for disaggregated systems in high-performance computing (HPC), data centers, and artificial intelligence (AI) applications.