Hello, Secretary Dong, Huawei recently launched the "stacked packaging" patent. I would like to ask if your company has any similar technical accumulation.

Changdian Technology: Hello, in the field of 2.5/3D integration technology, Changdian Technology actively promotes breakthroughs in traditional packaging technology, and takes the lead in adopting a variety of innovative integration technologies in the fields of wafer-level packaging, flip chip interconnection, through silicon via (TSV), etc. to develop differentiated solutions. In July last year, it launched the XDFOI? Full range of ultra-high density fan-out packaging solutions. This technology is an ultra-high density, multi-fan-out packaging high-density heterogeneous integration solution for chiplets, including 2D/2.5D/3D integration technology, which can provide customers with one-stop services from conventional density to ultra-high density, from extremely small size to extremely large size. Thank you for your attention and support to the company!