快报列表

Sony Launches New Back-Illuminated SPAD Device 2025-01-05 03:30
Your company has recently achieved the simultaneous shipment of 4-nanometer node multi-chip system-integrated packaging products, with the largest package area being about 1,500 square millimeters. Regarding this 4-nanometer multi-chip system-integrated packaging product and the packaging area of ​​up to 1,500 square millimeters, can your company introduce more technical details of the packaging method used this time, how many chips are integrated in this area, and whether it is a two-dimensional method or a stacked method? Thank you for your answer. 2024-12-31 15:43
China Resources Microelectronics and Ruichengxin Microelectronics jointly launched 0.153μm HD BCD process eFlash IP 2024-12-27 00:42
ZTE New Materials has achieved multi-dimensional technological innovation breakthroughs in diaphragm thickness, strength, pore size, etc. 2024-12-25 02:25
XDC and Lumileds Collaborate to Drive New Breakthroughs in MicroLED Display Technology 2024-12-24 14:02
Suzhou Saier Technology Co., Ltd. occupies the CSP packaging ultra-thin metal blade market 2024-12-23 20:35
Shanghai Industrial Technology Research Institute helps customers improve product competitiveness 2024-12-23 09:51
Shanghai Industrial Technology Research Institute has achieved breakthrough in the field of uncooled infrared detector technology 2024-12-23 09:49
Ruichuang Micronano releases independently developed high-sensitivity short-wave infrared detector chips and movement products 2024-12-20 22:23
Ruichuang Micronano demonstrates automotive-grade infrared thermal imaging technology at the Shanghai Auto Show 2024-12-20 22:20
Ruichuang team achieved a major breakthrough in the research of InAs baseband inter-cascade lasers 2024-12-20 22:16
SmartSens releases 50MP mobile phone image sensor with 0.7μm pixel size 2024-12-19 19:40
SmartSens releases 16-megapixel mobile phone image sensor 2024-12-19 19:39
ams OSRAM launches global Multi-Project Wafer (MPW) service 2024-12-19 16:37
Infineon Technologies develops world's thinnest silicon power wafer 2024-10-30 20:02